| PLASTIC AND RUBBER CYANOACRYLATES |
| RiteLok Plastic and Rubber cyanoacrylates are designed to give exceptional performance on difficult to bond rubbers and plastic,
together or in combination with metal and other materials.
Superior performance on PVC, ABS, nylon and certain fluorocarbons. |
| Rite-Lok PR-5 |
Low viscosity 5 cPs cyanoacrylates. Designed for optimum performance on a range of rubbers and plastics. |
| Rite-Lok PR-40 |
Designed to give maximum performance on difficult to bond rubbers and plastics. |
| Rite-Lok PR-100 |
Medium viscosity giving fast cure speed and high strength on EPDM rubber and other elastomers. |
| Rite-Lok PR-1500 |
Multi-purpose cyanoacrylate with gap filling properties. Gives high strength bonds and impact resistance on EPDM rubbers.
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| HIGH PERFORMANCE ETHYL CYANOACRYLATES |
| Extra low viscosities, ethyl based cyanoacrylates designed to penetrate by capillary action between pre-assembled components.
Exhibits super fast cure. |
| Rite-Lok EC-5 |
Low viscosity 5 cPs cyanoacrylates. Designed for optimum performance on a range of rubbers and plastics. |
| Rite-Lok EC-20 |
Low viscosity, 20 cPS, ethyl based formulation for closely fitting parts.
Bonds instantly on contact with good wicking and penetrating ability. |
| Rite-Lok EC-40 |
General purpose, 40 cps, ethyle cyanoacrylate.
Cures instantly on rubber, plastic and many other materials. Fills gaps to 0.004" (0.1mm). |
| Rite-Lok EC-100 |
Medium viscosity, 100 cPs, grade for general purpose bonding of rubbers and plastics. Fills gaps up to 0.006" (0.15mm). |
| Rite-Lok EC-600 |
Ethyl cyanoacrylate with moderate gap filling capability.
Higher, 600 cCPs, viscosity reduces migration of product from bond area. |
| Rite-Lok EC-1500 |
High viscosity ethyl cyanoacrylate for bonding porous materials or applications where gap filling is required.
Slower cure speed facilitates positioning of parts. May be fillet cured with Rite-Lok Activator. |
| Rite-Lok EC-2500 |
Extra high viscosity, 2500 cPs, ethyl cyanoacrylate. Used to bond porous surfaces. Fills gaps up to 0.008" (0.2mm).
Slow curing formulation allows maximum time for aligning substrates. |
| Rite-Lok EC-GEL |
Thixotropic gel formulation for maximum gap filling up to .01" (.25mm).
Can be applied on to vertical and porous surfaces. Product will not migrate or slump out of the joint and can be cured with an activator.
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